DocumentCode
3245045
Title
Comparison between beryllium-copper and tungsten high frequency air coplanar probes
Author
Carbonera, Joel Luis ; Morin, Gerard ; Cabon, Beatrice
Author_Institution
Centra R&D, SGS-Thomson Microelectron., Crolles, France
fYear
1995
fDate
16-20 May 1995
Firstpage
1475
Abstract
High frequency air coplanar probes using tungsten tips are now available for wafer probing with aluminum pads. Comparative study of the beryllium-copper and tungsten behavior is presented in terms of contact resistance values, stability and reproducibility. Finally, tungsten is demonstrated to be the best material for breaking the aluminum oxide over the pad to enable accurate high frequency probing.<>
Keywords
contact resistance; coplanar waveguides; integrated circuit measurement; microwave integrated circuits; microwave measurement; probes; BeCu; Si; W; contact resistance values; high frequency air coplanar probes; microwave measurement; reproducibility; stability; wafer probing; Aluminum oxide; Conducting materials; Contact resistance; Electrical resistance measurement; Frequency measurement; Hafnium; Needles; Probes; Silicon; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location
Orlando, FL, USA
ISSN
0149-645X
Print_ISBN
0-7803-2581-8
Type
conf
DOI
10.1109/MWSYM.1995.406252
Filename
406252
Link To Document