Title :
Effects of electrode surface morphology on electrical response of electrorheological fluids
Author :
Hanaoka, R. ; Murakumo, M. ; Anzai, Hidenobu ; Sakurai, K.
Author_Institution :
Dept. of Electr. Eng., Kanazawa Inst. of Technol., Ishikawa, Japan
Abstract :
In an attempt to enhance the electrical response of electrorheological (ER) fluids under DC electric field conditions, the influence of the electrode surface morphology has been studied using a rheometer in which the electrode surface was covered by the thin metallic net. The test fluids consist of microsphere particles suspended in two insulating oils, dimethylsilicone oil and fluoridated dimethylsilicone oil. The aggregation of particles and the ER responses in these fluids revealed the effect of local changes in the electric field on the metallic net surface. It is shown that a metallic net on the electrode surface is effective for further promoting the rheological response of the ER fluid suspended in fluoridated dimethylsilicone oil. The responses appear to depend on the material properties of the ER fluids and the mesh sizes of the metallic net
Keywords :
aggregation; dielectric liquids; electrodes; electrorheology; insulating oils; non-Newtonian fluids; organic compounds; organic insulating materials; DC electric field conditions; ER fluid; aggregation of particles; dimethylsilicone oil; electric field; electrical response; electrode surface; electrode surface morphology; electrorheological fluids; electrorheological responses; fluoridated dimethylsilicone oil; insulating oils; local changes; material properties; mesh sizes; metallic net; metallic net surface; microsphere particles; rheological response; rheometer; test fluids; thin metallic net; Electrodes; Erbium; Moisture; Oil insulation; Petroleum; Rough surfaces; Solids; Surface morphology; Surface roughness; Testing;
Conference_Titel :
Dielectric Liquids, 1999. (ICDL '99) Proceedings of the 1999 IEEE 13th International Conference on
Conference_Location :
Nara
Print_ISBN :
0-7803-4759-5
DOI :
10.1109/ICDL.1999.798961