Title :
Measuring the Electronic Properties of Poly-Si Thin Film Solar Cells Deposited on Textured Substrate
Author :
Muhida, R. ; Sutjipto, AGE ; Matsui, T. ; Toyama, T. ; Okamoto, H.
Author_Institution :
Dept. of Mechatronics Eng., Int. Islamia Univ., Kuala Lumpur
Abstract :
Electrical properties of PECVD produced poly-Si photovoltaic layers on the various textured substrates showing the light trapping effect have been investigated using an AC-conductivity technique. From temperature dependence of electron (hole) conductivities using n-i-n (p-i-p) structures, the Fermi level of the poly-Si layer on the slightly textured substrates is found to locate at the center of the band gap and this material is ´truly´ intrinsic. As RMS roughness of the textured substrate, sigma increases, the Fermi level becomes close to conduction band edge, and finally, the poly-Si layer on the highly textured substrate exhibits n-type character even though any deposition conditions for the poly-Si layers are not changed at all. Changes in electrical conductivities of the poly-Si thin films in conjunction with the results on photovoltaic performances and microstructure are also discussed
Keywords :
Fermi level; conduction bands; electrical conductivity; elemental semiconductors; energy gap; photovoltaic effects; plasma CVD; semiconductor thin films; silicon; solar cells; surface roughness; texture; AC-conductivity; Fermi level; PECVD; RMS roughness; Si; band gap; conduction band; electrical properties; electron conductivity; electronic properties; hole conductivity; light trapping effect; microstructure; n-i-n (p-i-p) structures; photovoltaic layers; textured substrate; thin film solar cells; Charge carrier processes; Conductivity; Electron traps; Photonic band gap; Photovoltaic cells; Photovoltaic systems; Solar power generation; Sputtering; Substrates; Temperature dependence;
Conference_Titel :
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
Conference_Location :
Bali
Print_ISBN :
1-4244-0189-5
Electronic_ISBN :
1-4244-0190-9
DOI :
10.1109/ICPADM.2006.284178