DocumentCode
3248086
Title
On-product performance improvement via advanced litho-cluster control using integrated metrology and multi-layer overlay target
Author
Bhattacharyya, Kaustuve ; Maassen, Martijn ; Schmitt-Weaver, Emil ; Tijssen, Robin ; Chen, Jackie ; Gin Hung
Author_Institution
ASML, Veldhoven, Netherlands
fYear
2015
fDate
3-6 May 2015
Firstpage
320
Lastpage
323
Abstract
Values of integrated metrology (IM) in high-volume manufacturing (HVM) have been a topic of discussion for over a decade. This publication finally brings the HVM data to take a fresh-look at the values of IM. A detail analysis was done using a very large amount of HVM data (2x-production node) in order to quantify both cycle time advantage and on-product overlay improvement benefits of IM. A significant work was done in order to understand the reasons behind these benefits and will be discussed in this publication.
Keywords
integrated circuit measurement; lithography; semiconductor technology; HVM; advanced lithocluster control; high-volume manufacturing; integrated metrology; multilayer overlay target; Accuracy; Fingerprint recognition; Manufacturing; Metrology; Performance evaluation; Process control; Time measurement; APC; Integrated metrology; control; multi-layer target; overlay;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2015.7164503
Filename
7164503
Link To Document