• DocumentCode
    3248232
  • Title

    Thermal ageing of ethylene propylene copolymer

  • Author

    Clavreul, R.

  • Author_Institution
    Electr. de France, Moret sur Loing, France
  • Volume
    2
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    813
  • Abstract
    In order to appreciate the ethylene propylene copolymer service life in electrical materials, we decided to carry out experiments on this material. The ethylene propylene copolymer is used as joints in captors of automatic materials, which are placed in the reactor of nuclear plants. The main stresses applied to this material are temperature, radiation and compression. The most critical parameter during accidental service conditions is temperature: all the electrical equipment inside the reactor must resist from ambient temperature to 156°C, but the ethylene propylene copolymer material is not recommended to be used at a constant temperature higher than 150°C. That is why we first studied the effect of temperature between 130°C and 190°C. The main properties we examined were the elongation and the tensile strength at break. The end-point criteria was considered to be 50% as the percentage of the initial value of the elongation at break. The service life of ethylene propylene at high temperatures was estimated from experimental results and the reactions mechanisms were proposed
  • Keywords
    ageing; elongation; insulation testing; life testing; mechanical properties; organic insulating materials; polymer blends; tensile strength; 130 to 190 C; accidental service conditions; electrical materials; elongation; end-point criteria; ethylene propylene copolymer; high temperatures; nuclear plants; polymer service life; reactions mechanisms; tensile strength; thermal ageing; Aging; Cables; Inductors; Joining materials; Phase change materials; Polymers; Rubber; Temperature; Thermal degradation; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on
  • Conference_Location
    Millbrae, CA
  • Print_ISBN
    0-7803-3580-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1996.564632
  • Filename
    564632