Title :
Study on geometry of valveless-micropump
Author :
Dau, V.T. ; Dinh, T.X. ; Tanaka, K. ; Sugiyama, S.
Author_Institution :
Dept. of Microsyst. Technol., Ritsumeikan Univ., Kusatsu, Japan
Abstract :
A gas-jet micro pump with novel cross-junction channel has been designed and fabricated using a Si micromachining process. The valveless micro pump is composed of a piezoelectric lead zirconate titanate (PZT) diaphragm actuator and fluidic network. The design of the valveless pump focuses on a cross-junction formed by the neck of the pump chamber and one outlet and two opposite inlet channels. The structure of cross-junction allows differences in fluidic resistance and fluidic momentum inside the channels during each PZT diaphragm vibration cycle, which leads to the gas flow being rectified without valves. The flow channels were easily fabricated by using silicon etching process. To investigate the effects of the structure of the cross-junction on the gas flow rate, two types of pump with different cross-junction were studied. The design and simulation were done using ANSYS-Fluent software. The simulations and experimental data revealed that the step-nozzle structure is much more advantageous than the planar structure. A flow rate of 5.2 ml/min was obtained for the pump with step structure when the pump was driven at its resonant frequency of 7.9 kHz by a sinusoidal voltage of 50 Vp-p.
Keywords :
geometry; lead compounds; microchannel flow; micromachining; micropumps; piezoelectric actuators; ANSYS-Fluent software; cross-junction channel; frequency 7.9 kHz; geometry; inlet channels; microfluidic network; micromachining process; piezoelectric lead zirconate titanate diaphragm actuator; planar structure; pump chamber; step-nozzle structure; valveless-micropump; Fluid flow; Geometry; Micromachining; Micropumps; Neck; Piezoelectric actuators; Pumps; Silicon; Titanium compounds; Valves; PZT; cross-junction channel; micro pump; valve-less;
Conference_Titel :
Advanced Intelligent Mechatronics, 2009. AIM 2009. IEEE/ASME International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2852-6
DOI :
10.1109/AIM.2009.5229995