Trends in BGA design methodologies

The largest and most influential factor on the advanced packaging market has been the insatiable consumer demand for products that are smaller, lighter, power efficient, and offer more functionality. Ball grid arrays (BGA) and chip scale packages (CSP) have emerged to meet these needs, and are a major factor in the miniaturization and functionality of today´s computing and communication products. The dramatic increase in use of advanced packages has created advanced challenges and demands on the traditional packaging market infrastructure. This paper explores the infrastructure and the changes taking place in the people, process, and tools involved in the development of advanced packaging solutions