• DocumentCode
    3249311
  • Title

    Numerical and experimental studies on temperature field of rotary MRF dampers

  • Author

    Di, Zheng ; Wencong, Ye ; Liyong, Hu ; Yimin, Deng ; Jianming, Zhan

  • Author_Institution
    Ningbo Inst. of Technol., Zhejiang Univ., Ningbo, China
  • fYear
    2009
  • fDate
    14-17 July 2009
  • Firstpage
    42
  • Lastpage
    46
  • Abstract
    In this paper, the heat generation principle of rotary MRF (MagnetoRheological Fluids) dampers was investigated, a mathematical model of heat source distribution was proposed, the temperature field caused by the heat sources was numerically simulated by means of ANSYS software, and the law of temperature distribution and rise was revealed. On the basis, a forced water-cooling system for the MRF dampers was designed to solve the temperature rise problem. Experiments were also conducted. Both numerical and experimental studies showed that, during the running of the dampers without any cooling measures being taken, the temperature of the dampers would continuously rise to a very high level before heat exchange balance was reached; while a forced water-cooling system was applied, the time for arriving at the heat exchange balance would be much shorter, and the temperature rise could be controlled within 20degC that is permissible for the practical application of the dampers.
  • Keywords
    cooling; damping; magnetorheology; temperature distribution; ANSYS software; cooling measures; forced water cooling system; heat exchange balance; heat generation principle; heat source distribution; magnetorheological fluids; mathematical model; rotary MRF damper; temperature distribution; temperature rise problem; Cooling; Damping; Force control; Force measurement; Mathematical model; Numerical simulation; Shock absorbers; Temperature distribution; Time measurement; Water heating; ANSYS; MRF; damper; numerical simulation; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Intelligent Mechatronics, 2009. AIM 2009. IEEE/ASME International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2852-6
  • Type

    conf

  • DOI
    10.1109/AIM.2009.5230042
  • Filename
    5230042