DocumentCode
3249541
Title
Monte Carlo simulation of 50 nm devices with Schottky contact model
Author
Matsuzawa, K. ; Uchida, K. ; Nishiyama, A.
Author_Institution
Adv. LSI Technol. Lab., Toshiba Corp., Yokohama, Japan
fYear
1999
fDate
1999
Firstpage
35
Lastpage
38
Abstract
A Schottky contact model was implemented as a boundary condition for a Monte Carlo device simulation. Unlike the ideal ohmic contact, thermal equilibrium is unnecessary around the Schottky contact. Therefore, the wide region of high impurity concentration around contacts is not required to maintain the thermal equilibrium, which means that it is possible to avoid assigning a lot of particles to the low-field region. The validity of the present boundary condition for contacts was verified by simulating a rectifying characteristic of a Schottky barrier diode. As an application example of the present boundary condition, we simulated the transport in n+nn+ structures with sub-0.1 μm channel length. We found direction dependence of the electron velocity dispersion, which indicates that the direction dependence of the diffusion constant or the carrier temperature should be taken into account in the hydrodynamic simulation for sub-0.1 μm devices
Keywords
Monte Carlo methods; Schottky barriers; Schottky diodes; electron mobility; semiconductor device models; solid-state rectifiers; 50 nm; 50 nm devices; Monte Carlo simulation; Schottky barrier diode; Schottky contact model; boundary condition; carrier temperature; channel length; device simulation; diffusion constant; direction dependence; electron velocity dispersion; hydrodynamic simulation; n+nn+ structures; rectifying characteristic; Boundary conditions; Electrons; Impurities; Monte Carlo methods; Ohmic contacts; Schottky barriers; Schottky diodes; Semiconductor diodes; Temperature control; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location
Kyoto
Print_ISBN
4-930813-98-0
Type
conf
DOI
10.1109/SISPAD.1999.799253
Filename
799253
Link To Document