DocumentCode :
3249908
Title :
Optimization of temperature-time profiles in rapid thermal annealing
Author :
Bork, I. ; Molzer, W. ; Nguyen, Ch D.
Author_Institution :
Infineon Technol., Munich, Germany
fYear :
1999
fDate :
1999
Firstpage :
107
Lastpage :
109
Abstract :
Rapid thermal annealing (RTA) is widely used in modern IC technology to reduce the amount of transient enhanced diffusion (TED) of dopants after ion implantation. The effect of diffusion reduction due to fast temperature ramping (50°C/s and above) and short annealing times (less than 10 seconds at 1000°C) is well known. However, a systematic investigation of TED over a broad range of temperature-time conditions can, to the authors´ best knowledge, not be found in the literature yet. In this simulation study we investigate phosphorus TED between 600°C and 1100°C for annealing times from a few seconds to several hours
Keywords :
doping profiles; ion implantation; rapid thermal annealing; annealing time; fast temperature ramping; ion implantation; rapid thermal annealing; temperature-time profiles; transient enhanced diffusion; Area measurement; Electronic mail; Equations; Implants; Ion implantation; Rapid thermal annealing; Semiconductor process modeling; Simulated annealing; Temperature dependence; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
4-930813-98-0
Type :
conf
DOI :
10.1109/SISPAD.1999.799272
Filename :
799272
Link To Document :
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