DocumentCode
3249945
Title
Aluminum silicon carbide for high performance microwave packages
Author
Bugeau, J.L. ; Heitkamp, K.M. ; Kellerman, D.
Author_Institution
Lockheed Sanders Inc., Nashua, NH, USA
fYear
1995
fDate
16-20 May 1995
Firstpage
1575
Abstract
Aluminum silicon carbide is rapidly becoming the material of choice for high performance microwave packages. This paper presents the results of extensive research performed to evaluate the integrity of aluminum silicon carbide for electronic packaging applications.<>
Keywords
MMIC; aluminium; casting; corrosion testing; fibre reinforced composites; integrated circuit packaging; microassembling; microwave integrated circuits; silicon compounds; Al; Al-SiC; Al/SiC composite; MIC; MMIC; SiC; electronic packaging; high performance microwave packages; metal matrix composite; Aluminum; Casting; Conducting materials; Electronic packaging thermal management; Electronics packaging; Furnaces; Preforms; Pressure control; Silicon carbide; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location
Orlando, FL, USA
ISSN
0149-645X
Print_ISBN
0-7803-2581-8
Type
conf
DOI
10.1109/MWSYM.1995.406276
Filename
406276
Link To Document