Title :
Aluminum silicon carbide for high performance microwave packages
Author :
Bugeau, J.L. ; Heitkamp, K.M. ; Kellerman, D.
Author_Institution :
Lockheed Sanders Inc., Nashua, NH, USA
Abstract :
Aluminum silicon carbide is rapidly becoming the material of choice for high performance microwave packages. This paper presents the results of extensive research performed to evaluate the integrity of aluminum silicon carbide for electronic packaging applications.<>
Keywords :
MMIC; aluminium; casting; corrosion testing; fibre reinforced composites; integrated circuit packaging; microassembling; microwave integrated circuits; silicon compounds; Al; Al-SiC; Al/SiC composite; MIC; MMIC; SiC; electronic packaging; high performance microwave packages; metal matrix composite; Aluminum; Casting; Conducting materials; Electronic packaging thermal management; Electronics packaging; Furnaces; Preforms; Pressure control; Silicon carbide; Thermal conductivity;
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-2581-8
DOI :
10.1109/MWSYM.1995.406276
