Assessment of temperature influence on partial discharges in epoxy/mica insulation

Author

Florkowska, B.

Author_Institution

Electr. Power Inst., Univ. of Min. & Metall., Cracow, Poland

fYear

1995

fDate

10-13 Jul 1995

Firstpage

356

Lastpage

360

Abstract

The influence of temperature in epoxy/mica insulation system on the partial discharge (PD) parameters was examined. Particularly, the changes of 3D PD patterns were observed when the temperature rose to 135°C. Possible causes of these changes are discussed taking into account different kinds of PD sources. The thermal stress influences the PD mechanism and accelerates the degrading process in insulation. This synergistic effect appears already in the initial stage of PD action. The increase of PD pulse magnitude and the PD number is observed. The resulting transition of PD patterns is analyzed

Keywords

composite insulating materials; delamination; epoxy insulation; mica; partial discharges; thermal stresses; 135 C; 3D patterns; PD pulse magnitude; degrading process; delamination; epoxy/mica insulation; partial discharges; synergistic effect; temperature influence; thermal stress; Dielectrics and electrical insulation; Electron emission; Electron traps; Gas insulation; Insulation testing; Materials testing; Partial discharges; Temperature dependence; Temperature distribution; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Conduction and Breakdown in Solid Dielectrics, 1995. ICSD'95., Proceedings of the 1995 IEEE 5th International Conference on

Conference_Location

Leicester

Print_ISBN

0-7803-2040-9

Type

conf

DOI

10.1109/ICSD.1995.523008

Filename

523008