• DocumentCode
    3250364
  • Title

    Telecom power system design for reliability compliance

  • Author

    Serban, Basil

  • Author_Institution
    Emerson Network Power, Lorain, OH
  • fYear
    2008
  • fDate
    14-18 Sept. 2008
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Power systems for telecommunications are designed to work safely and with a high level of reliability in environmental conditions of vibrations, earthquake, temperature and high altitude and humidity. They are also designed to sustain shock during handling and transportation. The main objective of this paper is to discuss the power system mechanical design for reliability compliance to seismic and drop test requirements. The finite element analysis (FEA) of the earthquake and drop tests simulate the NEBS GR 063 test conditions and verifies the test requirements. The paper discusses the rationale for computational simulations and describes in detail the FEA simulation approaches. A case study of a power system illustrates the best practice for FEA modeling to obtain accurate prediction of the mechanical response. The simulation results are discussed and compared with the test results. To reduce the risk of having the design invalidated by NEBS tests, the paper emphasize the need to qualify the FEA model before the prototype is tested. At this stage of product development, any test failure delays the product lunch and increases the design cost.
  • Keywords
    finite element analysis; power system reliability; telecommunication power supplies; NEBS GR 063 test conditions; drop test; finite element analysis; power system mechanical design; reliability compliance; seismic test; telecommunication power system design; Computational modeling; Earthquakes; Power system analysis computing; Power system modeling; Power system reliability; Power system simulation; Telecommunications; Temperature; Testing; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 2008. INTELEC 2008. IEEE 30th International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2055-1
  • Electronic_ISBN
    978-1-4244-2056-8
  • Type

    conf

  • DOI
    10.1109/INTLEC.2008.4664053
  • Filename
    4664053