• DocumentCode
    3250556
  • Title

    CFD thermal analysis for CO of TI lab

  • Author

    Dong, Han ; Qian, Han ; Yuping, Hong ; Xiaoming, Kong ; Zhaoxia, Luo ; Wenfei, Tang ; Wenxiong, Huang ; Rossi, Gianni ; Arena, Alessandra ; Bernardini, Vincenzo ; Salamandra, Paolo ; Suino, Diego

  • Author_Institution
    Huawei Technol. Co Ltd., Shenzhen
  • fYear
    2008
  • fDate
    14-18 Sept. 2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    With the growing power dissipation of information and telecommunication equipments, more concerns should be put on the cooling issues due to the reliability and OPEX requirements. This paper describes a fast optimizing cooling solution for the existing CO/ DC. As an important analysis approach, CFD simulation aims to improve the heat dissipation condition and the energy saving. With the application of CFD, lots of benefits from the fast optimization analysis can be obtained. In the paper, the local hot spots are firstly found out and solutions for these hot spots are proposed to keep the equipment operating in a proper environment and to guarantee the operation reliability. Then the layout of CO/DC is optimized to enhance the efficiency of the cooling system. Following the CFD analysis, several optimized solutions are presented. With the comparison of the results of different solutions in the experiment, the best one can be identified to be applied in a similar practical situation.
  • Keywords
    computational fluid dynamics; cooling; reliability; telecommunication power supplies; thermal analysis; CFD thermal analysis; OPEX requirements; center office; computational fluid dynamics; heat dissipation; power dissipation; reliability; Analytical models; Computational fluid dynamics; Cooling; Floors; Fluid dynamics; Information analysis; Power dissipation; Telecommunications; Testing; Tiles; CFD; CO; thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 2008. INTELEC 2008. IEEE 30th International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2055-1
  • Electronic_ISBN
    978-1-4244-2056-8
  • Type

    conf

  • DOI
    10.1109/INTLEC.2008.4664064
  • Filename
    4664064