DocumentCode
3250556
Title
CFD thermal analysis for CO of TI lab
Author
Dong, Han ; Qian, Han ; Yuping, Hong ; Xiaoming, Kong ; Zhaoxia, Luo ; Wenfei, Tang ; Wenxiong, Huang ; Rossi, Gianni ; Arena, Alessandra ; Bernardini, Vincenzo ; Salamandra, Paolo ; Suino, Diego
Author_Institution
Huawei Technol. Co Ltd., Shenzhen
fYear
2008
fDate
14-18 Sept. 2008
Firstpage
1
Lastpage
7
Abstract
With the growing power dissipation of information and telecommunication equipments, more concerns should be put on the cooling issues due to the reliability and OPEX requirements. This paper describes a fast optimizing cooling solution for the existing CO/ DC. As an important analysis approach, CFD simulation aims to improve the heat dissipation condition and the energy saving. With the application of CFD, lots of benefits from the fast optimization analysis can be obtained. In the paper, the local hot spots are firstly found out and solutions for these hot spots are proposed to keep the equipment operating in a proper environment and to guarantee the operation reliability. Then the layout of CO/DC is optimized to enhance the efficiency of the cooling system. Following the CFD analysis, several optimized solutions are presented. With the comparison of the results of different solutions in the experiment, the best one can be identified to be applied in a similar practical situation.
Keywords
computational fluid dynamics; cooling; reliability; telecommunication power supplies; thermal analysis; CFD thermal analysis; OPEX requirements; center office; computational fluid dynamics; heat dissipation; power dissipation; reliability; Analytical models; Computational fluid dynamics; Cooling; Floors; Fluid dynamics; Information analysis; Power dissipation; Telecommunications; Testing; Tiles; CFD; CO; thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunications Energy Conference, 2008. INTELEC 2008. IEEE 30th International
Conference_Location
San Diego, CA
Print_ISBN
978-1-4244-2055-1
Electronic_ISBN
978-1-4244-2056-8
Type
conf
DOI
10.1109/INTLEC.2008.4664064
Filename
4664064
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