Title :
Characterisation of porous silicon field emitter properties
Author :
Boswell, E.C. ; Huang, M. ; Smith, G.D.W. ; Wilshaw, P.R.
Author_Institution :
Dept. of Mater., Oxford Univ., UK
fDate :
July 30 1995-Aug. 3 1995
Abstract :
The field emission properties and structure of silicon field emitter tips, covered with a porous silicon layer have been studies. The emission from porous silicon emitters with a variety of morphologies, thicknesses and substrate types have been investigated using both an adapted scanning electron microscope and a field ion/field emission microscope. It has been found that the points of emission for p-type and n-type porous silicon have larger field enhancement factors and smaller emission areas than for non-porous emitters, which is consistent with presence of sharp surface asperities. Field emission is shown to originate at the porous surface rather than at the bulk silicon/porous silicon interface. Bright and dark field transmission electron microscope (TEM) analysis has been carried out on the samples. For p- and n-type material this has indicated a core within the emitter tip which is crystalline and covered with the surrounding amorphous porous silicon. This cores has an improved aspect ratio (over the original emitter shape) and a rough, silicon/porous silicon interface is observed.
Keywords :
electron field emission; elemental semiconductors; porous materials; scanning electron microscopy; silicon; transmission electron microscopy; vacuum microelectronics; Si; aspect ratio; emission areas; field emitter properties; field emitter tips; field enhancement factors; morphologies; porous material; scanning electron microscope; sharp surface asperities; substrate types; thicknesses; transmission electron microscope analysis; Current density; Hafnium; Manufacturing; Optical arrays; Optical buffering; Shape; Silicon; Surface morphology; Transmission electron microscopy; Wet etching;
Conference_Titel :
Vacuum Microelectronics Conference, 1995. IVMC., 1995 International
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-2143-X
DOI :
10.1109/IVMC.1995.486985