DocumentCode
3250986
Title
High-level fault simulation methodology for QDI template-based asynchronous circuits
Author
Ghavami, Behnam ; Tajary, Alireza ; Zarandi, Hamid-Reza
Author_Institution
Amirkabir Univ. of Technol., Tehran, Iran
fYear
2009
fDate
23-26 Jan. 2009
Firstpage
1
Lastpage
6
Abstract
Complexity of design and the lack of suitable test methodology are the major obstacles for widespread use of asynchronous circuit in digital circuit design. Template based synthesis of asynchronous circuits is accepted as an effective way to decrease the complexity of design. However, test frameworks such as fault simulator for synchronous circuits are not applicable for template based asynchronous circuits. In this paper we study transistor-level single stuck-at faults in traditional asynchronous templates and categorize their effects on the functionality of circuit. We prove by a mathematical specification that single stack-at fault in Pre-Charge Full Buffer templates has one of the three effects: deadlock, token generation and token dropping. This categorization is used to introducing a new high level fault simulation methodology for these circuits. Based on this strategy we develop a fault simulator and experimental results show the effectiveness of the proposed fault simulation methodology.
Keywords
asynchronous circuits; fault simulation; logic design; logic testing; QDI template-based asynchronous circuits; digital circuit design; fault simulator; high-level fault simulation methodology; mathematical specification; pre-charge full buffer templates; suitable test methodology; template based synthesis; token dropping; token generation; transistor-level single stuck-at faults; Asynchronous circuits; Circuit faults; Circuit simulation; Circuit synthesis; Circuit testing; Clocks; Delay effects; Digital circuits; Monitoring; System recovery; Fault simulation; High level fault simulator; Template based QDI circuits; Test;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2009 - 2009 IEEE Region 10 Conference
Conference_Location
Singapore
Print_ISBN
978-1-4244-4546-2
Electronic_ISBN
978-1-4244-4547-9
Type
conf
DOI
10.1109/TENCON.2009.5395804
Filename
5395804
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