DocumentCode
3251534
Title
Substrate enhanced gate current: device design and temperature impact and disturbs in programming flash memories with negative body bias
Author
Annunziata, R. ; Ghilardi, T. ; Tosi, M.
Author_Institution
Non Volatile Memory Process Dev., STMicroelectronics, Agrate Brianza, Italy
fYear
1999
fDate
14-16 June 1999
Firstpage
83
Lastpage
84
Abstract
Substrate negative polarization enhances gate current in submicron MOSFETs, improving two different hot carrier mechanisms (Esseni et al., 1998): CHEI (channel hot electron injection) and CISEI (channel induced secondary electron injection) (Bude et al, 1995). This effect is of particular interest in flash memory research, because it allows low power programming. In this paper, we first identify which of the two mechanisms prevails for each bias scheme, with or without body bias. Then, we analyse experimentally the impact of some device parameters and temperature on the total gate current, identifying the different trends of CHEI and CISEI. Finally, the programming disturbs are evaluated. Substrate polarization could worsen the electrical stress of the cells which belong to the same word line or bit line of the selected one, since the substrate is shared by the whole array.
Keywords
MOS memory circuits; MOSFET; PLD programming; electric current; flash memories; hot carriers; microprogramming; semiconductor device testing; thermal analysis; CHEI; CISEI; MOSFETs; bit line; body bias; channel hot electron injection; channel induced secondary electron injection; device design; device parameters; device temperature; electrical stress; flash memories; flash memory; gate current; hot carrier mechanisms; negative body bias; programming disturbs; substrate enhanced gate current; substrate negative polarization; substrate polarization; temperature impact; total gate current; word line; Doping; Electrons; Flash memory; Implants; MOSFETs; Nonvolatile memory; Polarization; Research and development; Temperature; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on
Conference_Location
Kyoto, Japan
Print_ISBN
4-930813-93-X
Type
conf
DOI
10.1109/VLSIT.1999.799351
Filename
799351
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