• DocumentCode
    3251534
  • Title

    Substrate enhanced gate current: device design and temperature impact and disturbs in programming flash memories with negative body bias

  • Author

    Annunziata, R. ; Ghilardi, T. ; Tosi, M.

  • Author_Institution
    Non Volatile Memory Process Dev., STMicroelectronics, Agrate Brianza, Italy
  • fYear
    1999
  • fDate
    14-16 June 1999
  • Firstpage
    83
  • Lastpage
    84
  • Abstract
    Substrate negative polarization enhances gate current in submicron MOSFETs, improving two different hot carrier mechanisms (Esseni et al., 1998): CHEI (channel hot electron injection) and CISEI (channel induced secondary electron injection) (Bude et al, 1995). This effect is of particular interest in flash memory research, because it allows low power programming. In this paper, we first identify which of the two mechanisms prevails for each bias scheme, with or without body bias. Then, we analyse experimentally the impact of some device parameters and temperature on the total gate current, identifying the different trends of CHEI and CISEI. Finally, the programming disturbs are evaluated. Substrate polarization could worsen the electrical stress of the cells which belong to the same word line or bit line of the selected one, since the substrate is shared by the whole array.
  • Keywords
    MOS memory circuits; MOSFET; PLD programming; electric current; flash memories; hot carriers; microprogramming; semiconductor device testing; thermal analysis; CHEI; CISEI; MOSFETs; bit line; body bias; channel hot electron injection; channel induced secondary electron injection; device design; device parameters; device temperature; electrical stress; flash memories; flash memory; gate current; hot carrier mechanisms; negative body bias; programming disturbs; substrate enhanced gate current; substrate negative polarization; substrate polarization; temperature impact; total gate current; word line; Doping; Electrons; Flash memory; Implants; MOSFETs; Nonvolatile memory; Polarization; Research and development; Temperature; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on
  • Conference_Location
    Kyoto, Japan
  • Print_ISBN
    4-930813-93-X
  • Type

    conf

  • DOI
    10.1109/VLSIT.1999.799351
  • Filename
    799351