• DocumentCode
    3251921
  • Title

    Comparative thermal noise analysis of DG MOSFET using SiO2, SiC-SiO2, Si3N4-SiO2, SiO2-Al2O3 as dielectric layer

  • Author

    Dash, Suryadeepta ; Panda, S. ; Maji, B. ; Mukhopadhyay, A.K.

  • Author_Institution
    Deptt. of Electron. & Telecommun. Eng., Narula Inst. of Technol., Kolkata, India
  • fYear
    2011
  • fDate
    26-28 Dec. 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The most promising device in the Nano scale range are based on multiple gate structures such as double-gate (DG) MOSFETs. These devices could be used for high frequency applications due to the significant increase of the transition frequency fT for these devices. For low noise radiofrequency applications, high frequency noise models are required. In this paper, compact channel noise models valid in all regions of operation for Double Gate (DG) MOSFETs have been developed and experimentally verified. Our compact channel noise model of a DG MOSFET includes the physics based expressions for thermal noise. Using this model the DG MOSFET noise performances are studied.
  • Keywords
    MOSFET; aluminium compounds; silicon compounds; thermal noise; DG MOSFET; Si3N4-SiO2; SiC-SiO2; SiO2; SiO2-Al2O3; comparative thermal noise analysis; dielectric layer; double-gate MOSFET; multiple gate structures; Analytical models; Capacitance; Logic gates; MOSFET circuits; Noise; Silicon; Thermal noise; Compact noise modelling; Double-gate MOSFETs; Thermal Noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communication and Industrial Application (ICCIA), 2011 International Conference on
  • Conference_Location
    Kolkata, West Bengal
  • Print_ISBN
    978-1-4577-1915-8
  • Type

    conf

  • DOI
    10.1109/ICCIndA.2011.6146690
  • Filename
    6146690