DocumentCode
3251921
Title
Comparative thermal noise analysis of DG MOSFET using SiO2 , SiC-SiO2 , Si3 N4 -SiO2 , SiO2 -Al2 O3 as dielectric layer
Author
Dash, Suryadeepta ; Panda, S. ; Maji, B. ; Mukhopadhyay, A.K.
Author_Institution
Deptt. of Electron. & Telecommun. Eng., Narula Inst. of Technol., Kolkata, India
fYear
2011
fDate
26-28 Dec. 2011
Firstpage
1
Lastpage
3
Abstract
The most promising device in the Nano scale range are based on multiple gate structures such as double-gate (DG) MOSFETs. These devices could be used for high frequency applications due to the significant increase of the transition frequency fT for these devices. For low noise radiofrequency applications, high frequency noise models are required. In this paper, compact channel noise models valid in all regions of operation for Double Gate (DG) MOSFETs have been developed and experimentally verified. Our compact channel noise model of a DG MOSFET includes the physics based expressions for thermal noise. Using this model the DG MOSFET noise performances are studied.
Keywords
MOSFET; aluminium compounds; silicon compounds; thermal noise; DG MOSFET; Si3N4-SiO2; SiC-SiO2; SiO2; SiO2-Al2O3; comparative thermal noise analysis; dielectric layer; double-gate MOSFET; multiple gate structures; Analytical models; Capacitance; Logic gates; MOSFET circuits; Noise; Silicon; Thermal noise; Compact noise modelling; Double-gate MOSFETs; Thermal Noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Communication and Industrial Application (ICCIA), 2011 International Conference on
Conference_Location
Kolkata, West Bengal
Print_ISBN
978-1-4577-1915-8
Type
conf
DOI
10.1109/ICCIndA.2011.6146690
Filename
6146690
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