Compact distributed RLC models for multilevel interconnect networks

Author

Davis, J.A. ; Meindl, J.D.

Author_Institution

Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1999

fDate

14-16 June 1999

Firstpage

165

Lastpage

166

Abstract

Novel compact expressions that describe the transient response of high-speed resistance, inductance, and capacitance (RLC) coupled transmission lines are rigorously derived for the first time. These new distributed RLC models compact distributed RLC models are used to project the impact of inductance on 3 GHz and 10 GHz multilevel interconnect networks implemented with copper and a low k (/spl sim/2.0) dielectric material, and reveal that peak crosstalk voltage is over 60% larger for 3 GHz and 10 GHz wiring levels than with traditional distributed RC models.

Keywords

RC circuits; capacitance; copper; coupled transmission lines; crosstalk; dielectric thin films; distributed parameter networks; electric resistance; inductance; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; permittivity; transient response; transmission line theory; 10 GHz; 3 GHz; Cu; copper/low k dielectric interconnects; distributed RC models; distributed RLC models; high-speed RLC coupled transmission lines; high-speed resistance/inductance/capacitance coupled transmission lines; inductance; multilevel interconnect networks; peak crosstalk voltage; transient response; wiring levels; Capacitance; Copper; Couplings; Crosstalk; Dielectric materials; Inductance; Transient response; Transmission lines; Voltage; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on

Conference_Location

Kyoto, Japan

Print_ISBN

4-930813-93-X

Type

conf

DOI

10.1109/VLSIT.1999.799395

Filename

799395