DocumentCode :
3252703
Title :
CFD simulation of thermal dissipation from fan-added plate fin and offset strip fin heat sinks
Author :
Kim, Won Nyun ; Kim, Seo Young ; Kang, Byung Ha
Author_Institution :
Visual Display Div., Samsung Electr., South Korea
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
213
Abstract :
In the present study, we have performed two-dimensional CFD simulations on thermal dissipation from isothermal plate fins and offset strip fins with a specific DC fan. Computations are implemented on a single flow passage between fins due to the periodicity in the lateral direction, and analysis of thermal performance is carried out for a heat sink for CPU cooling with a width of 60 mm and a length of 65 mm. As anticipated, the offset strip fin leads to 35% higher Nusselt number at each fin surface compared to the plate fin. However, the optimum OSF heat sink has 42% wider fin pitch to compensate for increased pressure drop, which results in smaller fin surface area than the plate fin heat sink. Consequently, the overall thermal performance of the offset strip fin heat sink is about 4% lower than that of the plate fin heat sink considered in this study, irrespective of the enhanced surface geometry.
Keywords :
channel flow; computational fluid dynamics; cooling; flow simulation; heat sinks; 60 mm; 65 mm; CFD simulation; CPU cooling; DC fan; Nusselt number; isothermal plate fins; offset strip fin heat sink; single flow passage; surface geometry; thermal dissipation; thermal properties; two-dimensional CFD simulations; Central Processing Unit; Computational fluid dynamics; Cooling; Geometry; Heat sinks; Heat transfer; Performance analysis; Research and development; Strips; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319176
Filename :
1319176
Link To Document :
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