Title :
One-dimensional analysis of thermoelectric modules
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Abstract :
A framework for the one-dimensional analysis of a thermoelectric module (TM) is provided. First, pertinent thermoelectric and irreversible effects are introduced and categorized. Then, heat conduction in a TM is analyzed. Next, a methodology is developed to determine the operating mode (refrigeration, generation, etc.) of a TM. Also, selected key parameters and the voltage distributions characterizing selected operating modes are provided. Finally, the analysis is extended to TMs subjected to convective boundary conditions. Novel aspects of the analysis are indicated in the Conclusions.
Keywords :
convection; cooling; copper; heat conduction; heavily doped semiconductors; interconnections; irreversible thermodynamics; modules; refrigeration; thermoelectric devices; thermoelectricity; Cu; convective boundary conditions; cooling; heat conduction; irreversible effects; one dimensional analysis; refrigeration; thermoelectric effects; thermoelectric modules; voltage distributions; Charge carriers; Conducting materials; Electric resistance; Refrigeration; Temperature; Thermal conductivity; Thermal loading; Thermal resistance; Thermoelectricity; Voltage;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1319181
