• DocumentCode
    3253076
  • Title

    MSM cathodes using /spl beta/-SiC

  • Author

    Davis, P.R. ; Mackie, W.A. ; Hinrichs, C.H. ; Parsons, J.D. ; King, J.M.

  • Author_Institution
    Linfield Res. Inst., McMinnville, OR, USA
  • fYear
    1995
  • fDate
    July 30 1995-Aug. 3 1995
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    We have undertaken the development of a cold cathode, operating with low power and high efficiency, suitable for applications requiring modest emitted electron current densities over a broad area. The cathode consists of a sandwich of high-bandgap semiconductor material between an injecting substrate layer and a thin conducting layer which acts as the interface to the vacuum. This vacuum interface material is chosen to provide an electrical contact with the semiconductor material and must exhibit relatively low work function, resistance to corrosion or other damage, and compatibility with the semiconductor material onto which it is grown. The design is intended to provide operation of the cathode as follows. Electrons from the substrate are injected into the conduction band of the semiconductor, travel to the surface conducting film under the effect of a slight externally applied electrical bias, and are then emitted through the vacuum interface layer.
  • Keywords
    cathodes; current density; electron field emission; metal-semiconductor-metal structures; silicon compounds; vacuum microelectronics; wide band gap semiconductors; work function; /spl beta/-SiC; MSM cathodes; SiC; cold cathode; externally applied electrical bias; high efficiency; high-bandgap semiconductor material; injecting substrate layer; low power; thin conducting layer; vacuum interface layer; Cathodes; Conducting materials; Contact resistance; Corrosion; Current density; Electric resistance; Electron emission; Semiconductor materials; Substrates; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1995. IVMC., 1995 International
  • Conference_Location
    Portland, OR, USA
  • Print_ISBN
    0-7803-2143-X
  • Type

    conf

  • DOI
    10.1109/IVMC.1995.487095
  • Filename
    487095