Impingement air cooled plate fin heat sinks. Part II - Thermal resistance model

Author

Duan, Zhipeng ; Mzychka, Y.S.

Author_Institution

Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John´´s, Nfld., Canada

fYear

2004

fDate

1-4 June 2004

Firstpage

436

Abstract

For pt.I, see ibid., vol.I, no., p.429-35 (2004). Impingement air cooling with heat sinks is one attractive solution in thermal management of electronic components. A simple impingement flow thermal resistance model based on developing laminar flow in rectangular channels is proposed. Experimental measurements of thermal resistance are performed with heat sinks of various impingement inlet widths, fin spacings, fin heights and airflow velocities to test the validity of the model. The accuracy of the predicted thermal resistance was found to be within 20% of the experimental data at channel Reynolds numbers less than 1200. The simple model is suitable for parametric design studies.

Keywords

channel flow; cooling; flow simulation; heat sinks; laminar flow; thermal management (packaging); thermal resistance; Reynolds number; airflow velocity; electronic component; fin height; fin spacing; flow thermal resistance model; heat sink; impingement air cooling; impingement inlet width; laminar flow; rectangular channel; thermal management; Electrical resistance measurement; Electronic components; Electronics cooling; Heat sinks; Performance evaluation; Resistance heating; Thermal management; Thermal management of electronics; Thermal resistance; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1319207

Filename

1319207