• DocumentCode
    3253493
  • Title

    Developing green supplier selection procedure: A DEA approach

  • Author

    Wen, U.P. ; Chi, J.M.

  • Author_Institution
    Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    29-31 Oct. 2010
  • Firstpage
    70
  • Lastpage
    74
  • Abstract
    This study considers a criteria set including green, traditional, and partnership issues for the green supplier selection problem. The criteria set takes carbon footprint into account, because the international regulations have paid much attention on the carbon footprint exposure in recent years. Moreover, most of the studies of green supplier selection use Analytical Hierarchical Process (AHP) and Analytical Network Process (ANP) to evaluate the suppliers. However, according to the limitation of this methodology, they can only deal with the small size problem. This study introduces Data Envelopment Analysis (DEA) into assessment, and combined with AHP to establish an integrated model. Furthermore, the assurance region is implemented not only to take the opinion of decision makers into consideration, but to increase the discriminating power of the model. Merging with the above criteria set, this evaluating model turns into a practical integrated framework of green supplier selection.
  • Keywords
    data envelopment analysis; decision making; environmental economics; supply chains; DEA approach; analytical hierarchical process; analytical network process; carbon footprint; data envelopment analysis; green supplier selection procedure; international regulations; partnership issues; Computational efficiency; Computational modeling; Green products; Manufacturing systems; Analytical Hierarchical Process (AHP); Analytical Network Process (ANP); Assurance Region (AR); Carbon Footprint; Data Envelopment Analysis (DEA); Green Supplier Selection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IE&EM), 2010 IEEE 17Th International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6483-8
  • Type

    conf

  • DOI
    10.1109/ICIEEM.2010.5646615
  • Filename
    5646615