DocumentCode
325420
Title
A CAD algorithm for coupling between dielectric covered MMICs in multi-chip assemblies
Author
Wang, Z. ; Jackson, R.W.
Author_Institution
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Volume
1
fYear
1998
fDate
7-12 June 1998
Firstpage
33
Abstract
An algorithm is presented for determining the coupling between sealant covered MMICs in a multi-chip module. This technique is computationally simple, appropriate for use with layout based circuit CAD software, and uses no numerical electromagnetics. It has been tested by comparison to fullwave electromagnetic simulation.
Keywords
MMIC; circuit layout CAD; multichip modules; CAD algorithm; MCM; dielectric covered MMICs; layout based circuit CAD software; multi-chip assemblies; multi-chip module; sealant covered MMICs; Assembly; Circuit simulation; Computational modeling; Coupling circuits; Design automation; Dielectric substrates; Electronic design automation and methodology; MMICs; Sealing materials; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.689318
Filename
689318
Link To Document