Title :
A CAD algorithm for coupling between dielectric covered MMICs in multi-chip assemblies
Author :
Wang, Z. ; Jackson, R.W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Abstract :
An algorithm is presented for determining the coupling between sealant covered MMICs in a multi-chip module. This technique is computationally simple, appropriate for use with layout based circuit CAD software, and uses no numerical electromagnetics. It has been tested by comparison to fullwave electromagnetic simulation.
Keywords :
MMIC; circuit layout CAD; multichip modules; CAD algorithm; MCM; dielectric covered MMICs; layout based circuit CAD software; multi-chip assemblies; multi-chip module; sealant covered MMICs; Assembly; Circuit simulation; Computational modeling; Coupling circuits; Design automation; Dielectric substrates; Electronic design automation and methodology; MMICs; Sealing materials; Voltage;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.689318
