Title :
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
Abstract :
The following topics are dealt with: SIP/SOP; lead-free flip chip interconnections; innovative testing methods; adhesives and encapsulants; low cost optoelectronic packaging technology; electrical modeling; integrated capacitor and resistor technology; flip chip packaging; wire bonding; characterization of failure mechanisms in advanced packaging; nanoscale and emerging technologies; materials for embedded passives; power delivery; three-dimensional packaging; lead-containing and lead-free solder joint reliability; flip chip underfill; manufacturing technology for optoelectronics; MEMS packaging; thermal and thermo-mechanical modeling of packaging polymer and low k dielectrics; MEMS processing and applications; bump reliability and electromigration; high speed and parallel optical modules; shock and vibration modeling; integrated inductors; leading edge design and manufacturing in electronic applications.
Keywords :
adhesives; capacitors; electromigration; electronics packaging; encapsulation; flip-chip devices; inductors; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; lead bonding; micromechanical devices; nanotechnology; optoelectronic devices; reliability; resistors; soldering; MEMS applications; MEMS packaging; MEMS processing; SIP; SOP; adhesives; advanced packaging failure mechanisms; bump electromigration; bump reliability; electrical modeling; electronic components; embedded passive component materials; emerging technologies; encapsulants; flip chip packaging; flip chip underfill; high speed optical modules; innovative testing methods; integrated capacitor technology; integrated inductors; integrated resistor technology; lead-containing solder joint reliability; lead-free flip chip interconnections; lead-free solder joint reliability; leading edge; low cost optoelectronic packaging technology; low k dielectrics thermo/thermo-mechanical modeling; nanoscale technologies; optoelectronic manufacturing technology; packaging polymer thermal/thermo-mechanical modeling; parallel optical modules; power delivery; shock modeling; single inline package; small outline package; three-dimensional packaging; vibration modeling; wire bonding;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319299
