DocumentCode :
3254557
Title :
Prediction model of thermal conductivities of agricultural products postharvest
Author :
Zhang, Min ; Che, Zhenhua ; Lu, Jiahua ; Chen, Jianhua ; Yang, Le ; Zhong, Zhiyou ; Zhao, Huizhong
Author_Institution :
Coll. of Food Sci. & Technol., Shanghai Ocean Univ., Shanghai, China
Volume :
8
fYear :
2010
fDate :
16-18 Oct. 2010
Firstpage :
3615
Lastpage :
3618
Abstract :
Knowledge of the thermal conductivity of agricultural products postharvest was fundamentally important in mathematical modeling studies for the design and optimization of agricultural products processing operations involving heat and mass transfer. The objective of this work was to develop an appropriate measurement system to obtain thermal conductivity values for yellow millet with various water contents at different temperature. A BP artificial neural network technique worked satisfactorily for the prediction of thermal conductivities of yellow millet as a function of water content and temperature. The optimal model consisted 2 hidden layer with 4 neurons per layer was obtained by comparison and analysis of the errors. The result shows that the optimal model was able to predict thermal conductivity with a mean relative error of 2.25%, a mean absolute error of 0.0029 W·m-1 K-1. As a result, the method can predict the thermal conductivities values of yellow millet at an acceptable level for engineering applications.
Keywords :
agricultural products; backpropagation; heat transfer; mass transfer; mathematical analysis; neural nets; thermal conductivity; BP artificial neural network technique; agricultural products postharvest; agricultural products processing operations; backpropagation; heat transfer; hidden layer; mass transfer; mathematical modeling; neurons per layer; thermal conductivities prediction model; water content function; yellow millet; Agricultural products; Artificial neural networks; Conductivity; Conductivity measurement; Neurons; Temperature measurement; Thermal conductivity; BP neural network; optimal model; thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Image and Signal Processing (CISP), 2010 3rd International Congress on
Conference_Location :
Yantai
Print_ISBN :
978-1-4244-6513-2
Type :
conf
DOI :
10.1109/CISP.2010.5646672
Filename :
5646672
Link To Document :
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