Title :
Millimeter-wave three-dimensional masterslice MMICs
Author :
Nishikawa, K. ; Kamogawa, K. ; Inoue, K. ; Onodera, K. ; Hirano, M. ; Tokumitsu, T. ; Toyoda, I.
Author_Institution :
NTT Wireless Syst. Labs., Kanagawa, Japan
Abstract :
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm/sup 2/. A U-band single-chip downconverter is also demonstrated.
Keywords :
MIMIC; integrated circuit design; integrated circuit technology; millimetre wave amplifiers; millimetre wave frequency convertors; 5.3 dB; 8 dB; GaAs; MIMIC; U-band single-chip downconverter; V-band amplifiers; design procedures; high integration levels; low fabrication cost; millimeter-wave 3D masterslice MMICs; three-dimensional masterslice MMICs; Circuit simulation; Coplanar waveguides; Couplings; Gallium arsenide; MMICs; Microstrip; Millimeter wave circuits; Propagation losses; Substrates; Wavelength measurement;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.689382
