• DocumentCode
    3254952
  • Title

    Modeling the Impact of Process Variation on Critical Charge Distribution

  • Author

    Ding, Qian ; Luo, Rong ; Wang, Hui ; Yang, Huazhong ; Xie, Yuan

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing
  • fYear
    2006
  • fDate
    24-27 Sept. 2006
  • Firstpage
    243
  • Lastpage
    246
  • Abstract
    In this paper, we investigate the impact of process variation on soft error vulnerability with Monte Carlo analysis. Our simulation results show that Qcritical variation (3sigma/mean) of four types of storage circuits caused by process variation can be as large as 13.6%. We also propose an empirical model to estimate the Qcritical variation caused by gate length and threshold voltage variations. Simulation results show that this simple model is very accurate. Based on this model, the dependence of Qcritical variation on gate length variation, threshold voltage variation, and correlation between gate lengths is studied, using 70 nm SRAM as benchmark circuit.
  • Keywords
    Monte Carlo methods; SRAM chips; semiconductor process modelling; Monte Carlo analysis; SRAM; benchmark circuit; critical charge distribution; empirical model; gate length variations; process variation impact; soft error vulnerability; storage circuits; threshold voltage variations; Circuit simulation; Computational modeling; Computer errors; Computer science; Error analysis; Monte Carlo methods; Neutrons; Random access memory; Threshold voltage; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2006 IEEE International
  • Conference_Location
    Taipei
  • Print_ISBN
    0-7803-9781-9
  • Electronic_ISBN
    0-7803-9782-7
  • Type

    conf

  • DOI
    10.1109/SOCC.2006.283890
  • Filename
    4063059