DocumentCode
3254952
Title
Modeling the Impact of Process Variation on Critical Charge Distribution
Author
Ding, Qian ; Luo, Rong ; Wang, Hui ; Yang, Huazhong ; Xie, Yuan
Author_Institution
Dept. of Electron. Eng., Tsinghua Univ., Beijing
fYear
2006
fDate
24-27 Sept. 2006
Firstpage
243
Lastpage
246
Abstract
In this paper, we investigate the impact of process variation on soft error vulnerability with Monte Carlo analysis. Our simulation results show that Qcritical variation (3sigma/mean) of four types of storage circuits caused by process variation can be as large as 13.6%. We also propose an empirical model to estimate the Qcritical variation caused by gate length and threshold voltage variations. Simulation results show that this simple model is very accurate. Based on this model, the dependence of Qcritical variation on gate length variation, threshold voltage variation, and correlation between gate lengths is studied, using 70 nm SRAM as benchmark circuit.
Keywords
Monte Carlo methods; SRAM chips; semiconductor process modelling; Monte Carlo analysis; SRAM; benchmark circuit; critical charge distribution; empirical model; gate length variations; process variation impact; soft error vulnerability; storage circuits; threshold voltage variations; Circuit simulation; Computational modeling; Computer errors; Computer science; Error analysis; Monte Carlo methods; Neutrons; Random access memory; Threshold voltage; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2006 IEEE International
Conference_Location
Taipei
Print_ISBN
0-7803-9781-9
Electronic_ISBN
0-7803-9782-7
Type
conf
DOI
10.1109/SOCC.2006.283890
Filename
4063059
Link To Document