Title :
LeadFrameOnChip offers integrated power bus and bond over active circuit
Author :
Efland, T. ; Abbott, D. ; Arellano, V. ; Buschbom, M. ; Chang, W. ; Hoffart, C. ; Hutter, L. ; Mai, Q. ; Nishimura, I. ; Pendharkar, S. ; Pierce, M. ; Shen, C.C. ; Thee, C.M. ; Vanhorn, H. ; Williams, C.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A metal system consisting of thick electroplated copper leads having a top plating of nickel and palladium cap are integrated on top of power ICs to form a bondable LeadFrameOnChip surface
Keywords :
electroplated coatings; integrated circuit bonding; integrated circuit metallisation; integrated circuit packaging; power integrated circuits; Cu; LeadFrameOnChip; Ni; Pd; bond-over-active-circuit; electroplated copper lead; integrated power bus; nickel plating; palladium cap; power IC; surface metallization; Active circuits; Copper; Instruments; Nickel; Palladium; Power integrated circuits; Surface resistance; Switches; Voltage control; Wafer bonding;
Conference_Titel :
Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on
Conference_Location :
Osaka
Print_ISBN :
4-88686-056-7
DOI :
10.1109/ISPSD.2001.934560
