• DocumentCode
    3256560
  • Title

    Breaking the silicon limit using semi-insulating Resurf layers

  • Author

    van Dalen, R. ; Rochefort, C. ; Hurkx, G.A.M.

  • Author_Institution
    Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    391
  • Lastpage
    394
  • Abstract
    In this paper, we present results on a novel multi-Resurf technique that involves the use of semi-insulating layers, in which the flattening of the electric field profile is achieved by virtue of a small leakage current. Unlike conventional Resurf devices, this technique provides a perfect flattening of the field profile without the requirement of an accurate charge balance. Experimental results show an increase in steady-state breakdown voltage from 19 to 85 V for a device having 4 μm drift regions doped at 5e16 cm-3, with corresponding Ron below the silicon limit
  • Keywords
    leakage currents; power MOSFET; semiconductor device breakdown; 85 V; RESURF device; breakdown voltage; electric field; leakage current; on-resistance; power MOSFET; semi-insulating layer; silicon limit; Diodes; Electrical resistance measurement; Etching; Immune system; Leakage current; MOSFETs; Manufacturing processes; Medical simulation; Silicon; Steady-state;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on
  • Conference_Location
    Osaka
  • ISSN
    1063-6854
  • Print_ISBN
    4-88686-056-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2001.934636
  • Filename
    934636