DocumentCode
3256992
Title
New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Author
Leib, Jürgen ; Töpper, Michael
Author_Institution
SCHOTT Electron. Packaging GmbH, Landshut, Germany
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
843
Abstract
Wafer-level-packaging has been proven in numerous applications as the optimal packaging solution for microelectronic devices. In the field of sensors and MEMS, packaging cost is still the major expense factor. In this paper, a new packaging technology, which is a combination of wafer-level-packaging (WLP) and MEMS processing technology is presented. With a strong focus on optical applications, the basic processing steps to form a unique wafer-level-package for sensor and MEMS devices is discussed.
Keywords
ball grid arrays; chip scale packaging; integrated circuit interconnections; micromechanical devices; BGA; MEMS processing technology; Si; WLP; microelectronic devices; optical devices; sensors; silicon-via-contacts; wafer-level chip-size packaging; wafer-level-packaging technology; CMOS image sensors; Contacts; Electronics packaging; Micromechanical devices; Optical arrays; Optical devices; Optical sensors; Sensor arrays; Silicon; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319435
Filename
1319435
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