Title :
New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Author :
Leib, Jürgen ; Töpper, Michael
Author_Institution :
SCHOTT Electron. Packaging GmbH, Landshut, Germany
Abstract :
Wafer-level-packaging has been proven in numerous applications as the optimal packaging solution for microelectronic devices. In the field of sensors and MEMS, packaging cost is still the major expense factor. In this paper, a new packaging technology, which is a combination of wafer-level-packaging (WLP) and MEMS processing technology is presented. With a strong focus on optical applications, the basic processing steps to form a unique wafer-level-package for sensor and MEMS devices is discussed.
Keywords :
ball grid arrays; chip scale packaging; integrated circuit interconnections; micromechanical devices; BGA; MEMS processing technology; Si; WLP; microelectronic devices; optical devices; sensors; silicon-via-contacts; wafer-level chip-size packaging; wafer-level-packaging technology; CMOS image sensors; Contacts; Electronics packaging; Micromechanical devices; Optical arrays; Optical devices; Optical sensors; Sensor arrays; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319435
