DocumentCode :
3257110
Title :
Challenges and advances in electrical interconnect analysis
Author :
Ruehli, Albert E. ; Heeb, Hansruedi
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1992
fDate :
8-12 Jun 1992
Firstpage :
460
Lastpage :
465
Abstract :
The authors review key issues regarding electrical interconnect analysis (EIA) for VLSI parasitic circuits. They give a general introduction to important aspects for technologies with a variety of performances and then review some issues relating to the state of the art for high-performance chips and packages. For high-performance technologies, the state-of-the-art tools leave a lot to be desired. The methods of choice for EIA are integral formulations like the method of moments or circuit-based techniques because the regions to be analyzed are usually open. Circuit based formulations like the rPEEC (retarded partial element equivalent circuit) approach are advantageous because they can be combined with other circuit models like transistors and because they can be used in the time and frequency domains. An example of a trace on a printed circuit board driven by a standard TTL 74F04 inverter chip is included
Keywords :
VLSI; circuit CAD; integrated circuit technology; packaging; printed circuit manufacture; VLSI parasitic circuits; circuit-based techniques; electrical interconnect analysis; frequency domains; high-performance chips; method of moments; packages; printed circuit board; rPEEC; retarded partial element equivalent circuit; standard TTL 74F04 inverter chip; time domains; Capacitance; Circuit simulation; Design automation; Electronic design automation and methodology; Integrated circuit interconnections; Logic; MOSFETs; Packaging; Transient analysis; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 1992. Proceedings., 29th ACM/IEEE
Conference_Location :
Anaheim, CA
ISSN :
0738-100X
Print_ISBN :
0-8186-2822-7
Type :
conf
DOI :
10.1109/DAC.1992.227759
Filename :
227759
Link To Document :
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