DocumentCode :
3257320
Title :
Schmitt trigger as an alternative to buffer insertion for delay and power reduction in VLSI interconnects
Author :
Saini, Sandeep ; Veeramachaneni, Sreehari ; Kumar, A. Mahesh ; Srinivas, M.B.
Author_Institution :
Center for VLSI & Embedded Syst. Technol., Int. Inst. of Inf. Technol.- Hyderabad, Hyderabad, India
fYear :
2009
fDate :
23-26 Jan. 2009
Firstpage :
1
Lastpage :
5
Abstract :
In interconnect bus coding techniques the presence of buffers is often ignored. Buffers are used to restore the signal level affected by parasitics. However buffers have a certain switching time that contribute to overall signal delay. Further the transition that happens in interconnects also contribute to crosstalk delay. Thus the overall delay in interconnects is due to combined effect of both buffer and crosstalk delay. Here a replacement of buffers with Schmitt trigger has been proposed for the same purpose of signal restoration. Due to lower threshold voltage of Schmitt trigger signal can rise early and the large noise margin of schmitt trigger helps in reducing the noise glitches as well. Hence we don´t need to add extra hardware for bus coding for the removal of higher crosstalk classes and delay reduction. Simulation results shows that the replacement process gives 59% delay reduction as compared to 45% in case of bus coding.
Keywords :
VLSI; buffer circuits; delay circuits; integrated circuit interconnections; trigger circuits; Schmitt trigger; VLSI interconnects; buffer insertion; bus coding; crosstalk delay; delay reduction; delay-power reduction; interconnect bus coding techniques; signal restoration; threshold voltage; Crosstalk; Delay effects; Embedded system; Information technology; Integrated circuit interconnections; Optical buffering; Threshold voltage; Trigger circuits; Very large scale integration; Wire; Schmitt trigger; delay reduction; interconnects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2009 - 2009 IEEE Region 10 Conference
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-4546-2
Electronic_ISBN :
978-1-4244-4547-9
Type :
conf
DOI :
10.1109/TENCON.2009.5396104
Filename :
5396104
Link To Document :
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