Title :
The thermally stimulated currents of SiO2/ low-density polyethylene micro- and nanocomposites
Author :
Yin, Yi ; li, Zhe ; Li, Xuguang ; Jiang, Pingkai
Author_Institution :
Sch. of Electron., Shanghai Jiao Tong Univ., Shanghai
Abstract :
Composite samples of low-density polyethylene (LDPE)/ nano-SiO2 and LDPE/ micro-SiO2 were prepared with a method of double-solution mixture, respectively. Depolarization currents of all samples were investigated with thermally-stimulated current. It is found that the currents of both composites increase with the loading level of nano-SiO2 and/or micro-SiO2, and the peak width of each composite is greater than that of pure LDPE. In addition, the peak location of the nanocomposite shifts as the loading level increases, while that of the microcomposite does not shift significantly. For the sake of understanding activation energy of both composites and pure LDPE, a method of initial rise method was used to analyze the depolarization current. It is found that LDPE has the greatest activation energy among all samples and the activation energy of both composites decreases with the increase of the loading level. Moreover, the activation energy of the nanocomposite is less than that of the microcomposite at the same loading level. As the nano-SiO2 loading level reaches 5.0% wt, the nanocomposite has the least activation energy of 0.25 eV.
Keywords :
filled polymers; mixtures; nanocomposites; nanofabrication; silicon compounds; thermally stimulated currents; SiO2; activation energy; double-solution mixture method; electron volt energy 0.25 eV; low-density polyethylene; microcomposite; nanocomposites; thermally stimulated-depolarization-current; Atomic force microscopy; Chemical analysis; Dielectrics and electrical insulation; Energy states; Nanocomposites; Polarization; Polyethylene; Polymers; Scanning electron microscopy; Thermal conductivity; Interface; Low-density polyethylene; Nano-SiO2; Nanocomposite; Thermally-stimulated current;
Conference_Titel :
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location :
Mie
Print_ISBN :
978-4-88686-005-7
Electronic_ISBN :
978-4-88686-006-4
DOI :
10.1109/ISEIM.2008.4664466