Design of Test Structures for Reduced Order Modeling of the Squeeze Film Damping in Mems

Author

Som, Aurelio ; Ballestra, Alberto

Author_Institution

Dept. of Mech. Eng., Politecnico di Torino

Volume

2

fYear

2006

fDate

27-29 Sept. 2006

Firstpage

341

Lastpage

344

Abstract

In this work the effect of the squeeze film damping on MEMS structures is studied. As the simulation of the microsystems involves different physical domains, the analysis with numerical methods can turn out remarkably onerous such as when, due to technological reasons, the membrane is built with several holes. In this case the reduced order modeling is preferable. In the present work the non-linear coefficients of equivalent damping and stiffness by finite element models are investigated to be exported in a reduced order model. By means of numerical finite element calculation is studied the sensitivity analysis related to design parameters such as dimension of the plate and the presence, or lack, of holes

Keywords

damping; finite element analysis; micromechanical devices; reduced order systems; sensitivity analysis; MEMS; design parameters; equivalent damping; finite element models; reduced order modeling; sensitivity analysis; squeeze film damping; test structures design; Analytical models; Damping; Electrodes; Finite element methods; Frequency; Micromechanical devices; Navier-Stokes equations; Shock absorbers; Springs; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

International Semiconductor Conference, 2006

Conference_Location

Sinaia

Print_ISBN

1-4244-0109-7

Type

conf

DOI

10.1109/SMICND.2006.284014

Filename

4063242