• DocumentCode
    3258258
  • Title

    Effects of coupling agent and filler dispersion on V-t characteristics of epoxy/silica nanocomposites

  • Author

    Iizuka, T. ; Ohki, Y. ; Tanaka, T.

  • Author_Institution
    Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    Epoxy/silica nanocomposites were investigated to clarify the effects of coupling agents and the degree of filler dispersion as for treeing breakdown V-t characteristics and PD (partial discharge) resistance performances. In the former case, it was clarified that homogeneous dispersion is critical to obtain satisfactory V-t characteristics, and that the addition of silane coupling agent would help improve such characteristics further. In the latter case, on the other hand, the simple dispersion was sufficient to improve PD resistance, which is considered to be less sensitive to the degree of dispersion and the introduction of coupling agents. In order to help make such difference clear, observation was conducted on the state of nano filler dispersion and treed regions by SEM and TEM. Explanation was postulated on how nano fillers act on propagation of trees and progress of PD erosion.
  • Keywords
    dielectric materials; epoxy insulation; filled polymers; nanocomposites; organic-inorganic hybrid materials; partial discharges; silicon compounds; trees (electrical); SEM; SiO2; TEM; V-t characteristics; epoxy/silica nanocomposites; filler dispersion; partial discharge; silane coupling agent; treeing breakdown; Breakdown voltage; Dispersion; Electric breakdown; Electric resistance; Epoxy resins; Immune system; Nanocomposites; Partial discharges; Polymers; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664496
  • Filename
    4664496