• DocumentCode
    3258291
  • Title

    Film morphology of dibenzochrysene

  • Author

    Fujita, K. ; Kimura, M. ; Yoshokawa, H. ; Mori, T.

  • Author_Institution
    Grad. Sch. of Eng., Nagoya Univ., Nagoya
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    67
  • Lastpage
    70
  • Abstract
    For organic field effect transistors (OFETs), pentacene is often used as a typical semiconductor material and reported to have as high carrier mobility as a-Si. Dibenzochrysene (DBC) as well as pentacene consist of only aromatic rings. DBC can be synthesized by simple procedure and has higher solubility than pentacene. We studied film morphology of DBC fabricated by deposition or spin-coating. It was found that the morphology of DBC film depended on a deposition rate. The films fabricated by the deposition rate of 0.002 nm/s and by spin-coating were island structure and amorphous, respectively. The morphology of DBC films changed with time. The post films showed higher crystalline than before. We also studied the effect of buffer layer on the suppression of molecular migration.
  • Keywords
    X-ray diffraction; atomic force microscopy; buffer layers; crystal structure; insulating thin films; island structure; organic field effect transistors; organic semiconductors; spin coating; vacuum deposited coatings; X-ray diffraction; amorphous films; atomic force microscopy; buffer layer effect; crystalline films; deposition rate; dibenzochrysene; film morphology; island structure; molecular migration suppression; organic field effect transistors; spin-coating; vacuum deposition; Atomic force microscopy; Buffer layers; Morphology; OFETs; Organic light emitting diodes; Organic thin film transistors; Pentacene; Semiconductor films; Thin film transistors; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664498
  • Filename
    4664498