DocumentCode
3258338
Title
Dielectric characteristics of SiO2 /LDPE micro- and nanocomposites
Author
Wang, Yaqun ; li, Zhe ; Yin, Yi ; Huang, Xingyi
Author_Institution
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., Shanghai
fYear
2008
fDate
7-11 Sept. 2008
Firstpage
79
Lastpage
82
Abstract
Dielectric characteristics of LDPE filled with micro- and nano-sized particles of SiO2 were studied in this paper. The dependence of the loss factor and dielectric constant of composites on frequency was investigated in a relatively wide frequency range, and the roles of the size and loading level of the filler are discussed. Compared with additive-free LDPE, incorporating nano-sized SiO2 can effectively reduce tandelta of all nanocomposites in a low frequency range, while only loading an appropriate amount of micro-filler has the same effect. Peaks of tandelta were observed in any composite sample, and the peak-value location is almost frequency-independent for micro-composites, while there are no peaks for virgin LDPE. Tandelta values of the nanocomposites with proper filler content are much less than those of the microcomposites. For both nano- and microcomposites, by controlling the content of filler, the dielectric constant can be changed to a higher or lower value than that of virgin LDPE.
Keywords
dielectric losses; nanocomposites; nanoparticles; organic compounds; permittivity; silicon compounds; SiO2; SiO2-low-density polyethylene composite; dielectric characteristics; dielectric constant; loss factor; microcomposites; microfiller; microsized particles; nanocomposites; nanosized particles; Chemical analysis; Dielectric constant; Dielectric loss measurement; Dielectric materials; Dielectrics and electrical insulation; Frequency; Laboratories; Nanocomposites; Polymers; Solids; Low-density polyethylene; Nano-SiO2 ; Nanocomposite; Permittivity; Tanδ;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location
Mie
Print_ISBN
978-4-88686-005-7
Electronic_ISBN
978-4-88686-006-4
Type
conf
DOI
10.1109/ISEIM.2008.4664501
Filename
4664501
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