• DocumentCode
    3258338
  • Title

    Dielectric characteristics of SiO2/LDPE micro- and nanocomposites

  • Author

    Wang, Yaqun ; li, Zhe ; Yin, Yi ; Huang, Xingyi

  • Author_Institution
    Dept. of Electr. Eng., Shanghai Jiao Tong Univ., Shanghai
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    Dielectric characteristics of LDPE filled with micro- and nano-sized particles of SiO2 were studied in this paper. The dependence of the loss factor and dielectric constant of composites on frequency was investigated in a relatively wide frequency range, and the roles of the size and loading level of the filler are discussed. Compared with additive-free LDPE, incorporating nano-sized SiO2 can effectively reduce tandelta of all nanocomposites in a low frequency range, while only loading an appropriate amount of micro-filler has the same effect. Peaks of tandelta were observed in any composite sample, and the peak-value location is almost frequency-independent for micro-composites, while there are no peaks for virgin LDPE. Tandelta values of the nanocomposites with proper filler content are much less than those of the microcomposites. For both nano- and microcomposites, by controlling the content of filler, the dielectric constant can be changed to a higher or lower value than that of virgin LDPE.
  • Keywords
    dielectric losses; nanocomposites; nanoparticles; organic compounds; permittivity; silicon compounds; SiO2; SiO2-low-density polyethylene composite; dielectric characteristics; dielectric constant; loss factor; microcomposites; microfiller; microsized particles; nanocomposites; nanosized particles; Chemical analysis; Dielectric constant; Dielectric loss measurement; Dielectric materials; Dielectrics and electrical insulation; Frequency; Laboratories; Nanocomposites; Polymers; Solids; Low-density polyethylene; Nano-SiO2; Nanocomposite; Permittivity; Tanδ;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664501
  • Filename
    4664501