• DocumentCode
    3259139
  • Title

    The effects of plasticizer on the mechanical and electrical characteristics of PLA

  • Author

    Shinyama, Katsuyoshi ; Fujita, Shigetaka

  • Author_Institution
    Hachinohe Inst. of Technol., Hachinohe
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    267
  • Lastpage
    270
  • Abstract
    Polylactic acid (PLA), a biodegradable plastic, has excellent electrical insulation properties. Being a hard resin, however, PLA is difficult to apply to coated cable. In this study, we blended a plasticizer with PLA to soften it, and examined the effects of the plasticizer on the mechanical and electrical characteristics of PLA. The glass transition temperature (Tg) and the melting point (Tm) had a tendency to decrease with an increase in the amount of plasticizer. With an increase in the amount of plasticizer, the tensile strength had a tendency to decrease and the breaking elongation to increase. As described above, PLA became softer with an increase in the amount of plasticizer. At 298 K, dielectric breakdown strength (EB) was about 5 MV/cm, irrespective of the presence of the plasticizer; the plasticizer showed almost no effect on EB. At 353 K, however, EB had a tendency to increase with an increase in the amount of plasticizer.
  • Keywords
    biodegradable materials; electric breakdown; elongation; glass transition; melting point; polymers; tensile strength; biodegradable plastic; dielectric breakdown strength; electrical insulation properties; electrical properties; elongation; glass transition temperature; hard resin; mechanical properties; melting point; plasticizer; polylactic acid; tensile strength; Biodegradable materials; Biological materials; Dielectric breakdown; Dielectrics and electrical insulation; Electric variables; Electrodes; Plastic insulation; Programmable logic arrays; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664548
  • Filename
    4664548