DocumentCode
3259139
Title
The effects of plasticizer on the mechanical and electrical characteristics of PLA
Author
Shinyama, Katsuyoshi ; Fujita, Shigetaka
Author_Institution
Hachinohe Inst. of Technol., Hachinohe
fYear
2008
fDate
7-11 Sept. 2008
Firstpage
267
Lastpage
270
Abstract
Polylactic acid (PLA), a biodegradable plastic, has excellent electrical insulation properties. Being a hard resin, however, PLA is difficult to apply to coated cable. In this study, we blended a plasticizer with PLA to soften it, and examined the effects of the plasticizer on the mechanical and electrical characteristics of PLA. The glass transition temperature (Tg) and the melting point (Tm) had a tendency to decrease with an increase in the amount of plasticizer. With an increase in the amount of plasticizer, the tensile strength had a tendency to decrease and the breaking elongation to increase. As described above, PLA became softer with an increase in the amount of plasticizer. At 298 K, dielectric breakdown strength (EB) was about 5 MV/cm, irrespective of the presence of the plasticizer; the plasticizer showed almost no effect on EB. At 353 K, however, EB had a tendency to increase with an increase in the amount of plasticizer.
Keywords
biodegradable materials; electric breakdown; elongation; glass transition; melting point; polymers; tensile strength; biodegradable plastic; dielectric breakdown strength; electrical insulation properties; electrical properties; elongation; glass transition temperature; hard resin; mechanical properties; melting point; plasticizer; polylactic acid; tensile strength; Biodegradable materials; Biological materials; Dielectric breakdown; Dielectrics and electrical insulation; Electric variables; Electrodes; Plastic insulation; Programmable logic arrays; Temperature distribution; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location
Mie
Print_ISBN
978-4-88686-005-7
Electronic_ISBN
978-4-88686-006-4
Type
conf
DOI
10.1109/ISEIM.2008.4664548
Filename
4664548
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