DocumentCode
3259152
Title
Effects of corona discharge on surface deterioration of silicone rubber insulator under reduced pressures
Author
Du, B.X. ; Liu, Yong ; Wang, R.L.
Author_Institution
Key Lab. of Power Syst. Simulation & Control of Minist. of Educ., Tianjin Univ., Tianjin
fYear
2008
fDate
7-11 Sept. 2008
Firstpage
271
Lastpage
274
Abstract
With the broad application of silicone rubber (SIR) insulator in high-altitude regions, corona degradation is one of the inevitable electrical degradation caused by electric stress due to the organic properties of SIR. Although this phenomenon is investigated at atmospheric pressure, there is little investigation at low pressures. It is urgent to systematically investigate effects of low pressure on the corona degradation for the reliable application. Experiments were carried out in a decompression chamber and the ambient pressure was reduced by a rotary pump from the atmospheric pressure to 40 kPa. The specimens were exposed to corona discharges at low pressures for different lapse time. The surface static contact angles on the insulator were measured to reveal the hydrophobicity changes. The currents during corona discharges at different low pressures were measured to confirm the corona degradation with variation of the pressures. The results obtained showed that the intensity of corona discharge increased with reducing the ambient pressure, which accelerated the process of corona degradation.
Keywords
atmospheric pressure; corona; silicone rubber insulators; ambient pressure; atmospheric pressure; corona discharge effect; decompression chamber; electric stress; electrical degradation; hydrophobicity; low pressure effects; pressure 40 kPa; silicone rubber insulator; surface deterioration; surface static contact angles; Atmospheric measurements; Corona; Dielectrics and electrical insulation; Electrodes; Ocean temperature; Rubber; Sea surface; Stress; Surface discharges; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location
Mie
Print_ISBN
978-4-88686-005-7
Electronic_ISBN
978-4-88686-006-4
Type
conf
DOI
10.1109/ISEIM.2008.4664549
Filename
4664549
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