Silicate contamination on ceramic IC packages and its effect on lid adhesion properties

Author

Chin, B. ; Lim, K. ; Chong, Y.C.

Author_Institution

Integrated Circuits Bus. Div., Hewlett-Packard, Singapore

fYear

1995

fDate

27 Nov-1 Dec 1995

Firstpage

221

Lastpage

224

Abstract

This paper presents a case history of a packaging failure that was caused by contamination introduced in one of the processes on the assembly line. Results of the failure analysis via the use of the X-Ray Photoelectron Spectroscopy (XPS) for contamination at various stages of the Ceramic Pin Grid Array (CPGA) packaging assembly process, and an analysis of the contact angles obtained from the ceramic substrate surface to indicate wettability are presented

Keywords

X-ray photoelectron spectra; adhesion; ceramics; contact angle; failure analysis; hybrid integrated circuits; impurities; integrated circuit packaging; integrated circuit reliability; wetting; XPS; ceramic IC packages; ceramic pin grid array packaging assembly process; ceramic substrate surface; contact angles; lid adhesion properties; packaging failure; silicate contamination; wettability; Adhesives; Assembly; Ceramics; Contamination; Grain size; History; Integrated circuit packaging; Rough surfaces; Surface roughness; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 1995., Proceedings of the 1995 5th International Symposium on the

Print_ISBN

0-7803-2797-7

Type

conf

DOI

10.1109/IPFA.1995.487627

Filename

487627