DocumentCode :
3260313
Title :
Insulation technology for power semiconductor modules
Author :
Muto, Hirotaka ; Shiota, Hiroki ; Hasegawa, Taketoshi
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Co., Amagasaki
fYear :
2008
fDate :
7-11 Sept. 2008
Firstpage :
671
Lastpage :
671
Abstract :
As key devices for power conversion, we can expect power semiconductor modules to become increasingly sophisticated in functions and performance in the years to come. This will require the development of advanced insulation materials and design technologies.
Keywords :
insulation; power conversion; power semiconductor devices; insulation materials; insulation technology; power conversion; power semiconductor modules; Ceramics; Dielectrics and electrical insulation; Electrodes; Insulation testing; Multichip modules; Partial discharges; Semiconductor device testing; Semiconductor materials; Substrates; Voltage; Insulation; Partial discharge; Power module;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location :
Mie
Print_ISBN :
978-4-88686-005-7
Electronic_ISBN :
978-4-88686-006-4
Type :
conf
DOI :
10.1109/ISEIM.2008.4664606
Filename :
4664606
Link To Document :
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