DocumentCode
3260623
Title
Packaging of VLSI devices
Author
Reichl, H.
Author_Institution
Tech. Univ. Berlin, West Germany
fYear
1989
fDate
8-12 May 1989
Firstpage
23132
Lastpage
24593
Abstract
VLSI technologies are characterized by a drastic reduction of component size and the economical production of large-area chips. Electrical and geometrical characteristics of modern VLSI chips require a synchronized progress in the development of chip and board technologies. Furthermore, alternative hierarchies within electronic systems, such as the application of multichip modules or microsystems, must be considered. The geometrical and electrical chip parameters are discussed, and the requirements for future packaging technologies are summarized
Keywords
VLSI; packaging; VLSI devices; component size; electrical characteristics; electronic systems; geometrical characteristics; microsystems; multichip modules; Bonding; Cost function; Electronics packaging; Geometry; Integrated circuit packaging; Niobium; Pins; Printed circuits; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
Conference_Location
Hamburg
Print_ISBN
0-8186-1940-6
Type
conf
DOI
10.1109/CMPEUR.1989.93485
Filename
93485
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