• DocumentCode
    3260880
  • Title

    Post-routing redundant via insertion for yield/reliability improvement

  • Author

    Lee, Kuang-Yao ; Wang, Ting-Chi

  • Author_Institution
    Dept. of Comput. Sci., National Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2006
  • fDate
    24-27 Jan. 2006
  • Abstract
    Reducing the yield loss due to via failure is one of the important problems in design for manufacturability. A well known and highly recommended method to improve via yield/reliability is to add redundant vias. In this paper, we study the problem of post-routing redundant via insertion and formulate it as a maximum independent set (MIS) problem. We present an efficient graph construction algorithm to model the problem, and an effective MIS heuristic to solve the problem. The experimental results show that our MIS heuristic inserts more redundant vias and distributes them more uniformly among via layers than a commercial tool and an existing method. The number of inserted redundant vias can be increased by up to 21.24%. Besides, since redundant vias can be classified into on-track and off-track ones, and on-track ones have better electrical properties, we also present two methods (one is modified from the MIS heuristic, and the other is applied as a post processor) to increase the amount of on-track redundant vias. The experimental results indicate that both methods perform very well.
  • Keywords
    integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; graph construction algorithm; maximum independent set problem; post-routing redundant via insertion; reliability improvement; via failure; yield improvement; yield loss reduction; Computer aided manufacturing; Computer science; Design for manufacture; Design methodology; Electromigration; Integrated circuit layout; Manufacturing processes; Routing; Semiconductor device manufacture; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation, 2006. Asia and South Pacific Conference on
  • Print_ISBN
    0-7803-9451-8
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2006.1594699
  • Filename
    1594699