Surface-normal electro-aborption MQW modulator-based chip-scale optical interconnects

Author

Tian Gu ; Venkataraman, Anupama P. ; Haney, Michael W.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA

fYear

2013

fDate

8-10 July 2013

Firstpage

60

Lastpage

61

Abstract

A MQW/EAM-based chip-scale photonic interconnect concept, that uses efficient CW VCSELs as sources and a lithographically-defined high-density multi-mode waveguide fabric, is analyzed. Projected energy-per-bit, bandwidth density, and packaging tolerances enable scaling with foreseeable CMOS technology.

Keywords

CMOS integrated circuits; electro-optical modulation; electroabsorption; electronics packaging; integrated optoelectronics; laser cavity resonators; optical interconnections; photolithography; quantum well lasers; surface emitting lasers; waveguide lasers; CMOS technology; CW VCSEL; MQW-EAM-based chip-scale photonic interconnect; bandwidth density; chip-scale optical interconnects; energy-per-bit density; lithographically-defined high-density multimode waveguide fabric; packaging tolerances; surface-normal electroabsorption MQW modulator; Couplers; Couplings; Modulation; Optical interconnections; Optical waveguides; Quantum well devices; Vertical cavity surface emitting lasers; Optical Interconnects; Photonic Integrated Circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics Society Summer Topical Meeting Series, 2013 IEEE

Conference_Location

Waikoloa, HI

Print_ISBN

978-1-4673-5059-4

Type

conf

DOI

10.1109/PHOSST.2013.6614539

Filename

6614539