Title :
Surface-normal electro-aborption MQW modulator-based chip-scale optical interconnects
Author :
Tian Gu ; Venkataraman, Anupama P. ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
A MQW/EAM-based chip-scale photonic interconnect concept, that uses efficient CW VCSELs as sources and a lithographically-defined high-density multi-mode waveguide fabric, is analyzed. Projected energy-per-bit, bandwidth density, and packaging tolerances enable scaling with foreseeable CMOS technology.
Keywords :
CMOS integrated circuits; electro-optical modulation; electroabsorption; electronics packaging; integrated optoelectronics; laser cavity resonators; optical interconnections; photolithography; quantum well lasers; surface emitting lasers; waveguide lasers; CMOS technology; CW VCSEL; MQW-EAM-based chip-scale photonic interconnect; bandwidth density; chip-scale optical interconnects; energy-per-bit density; lithographically-defined high-density multimode waveguide fabric; packaging tolerances; surface-normal electroabsorption MQW modulator; Couplers; Couplings; Modulation; Optical interconnections; Optical waveguides; Quantum well devices; Vertical cavity surface emitting lasers; Optical Interconnects; Photonic Integrated Circuits;
Conference_Titel :
Photonics Society Summer Topical Meeting Series, 2013 IEEE
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4673-5059-4
DOI :
10.1109/PHOSST.2013.6614539
