DocumentCode :
3261310
Title :
SETIPIC: electrothermal simulator for power integrated circuits in EDGE environment
Author :
Hebrard, Luc ; Klingelhofer, Christian ; Jacquemod, Gilles ; Boutherin, Bernard ; Le Helley, Michel
Author_Institution :
LEAME, Ecole Centrale de Lyon, Ecully, France
fYear :
1992
fDate :
1-5 Jun 1992
Firstpage :
214
Lastpage :
219
Abstract :
The authors present SETIPIC, a software to simulate the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface to the designer, SETIPIC has been integrated in the EDGE CAD system. The software aspect of this integration is explained. SETIPIC works around SPICE3 (electric simulation) and PICMOST (thermal simulation). This thermal simulator which calculates the thermal distribution on the layout surface of a chip taken in its environment is also described. Finally, an infrared experimental set up is proposed to validate SETIPIC and some thermal and electrothermal simulation results are given
Keywords :
SPICE; circuit CAD; circuit layout CAD; digital simulation; integrated circuit technology; power integrated circuits; temperature distribution; thermal analysis; EDGE CAD system; EDGE environment; PICMOST; SETIPIC; SPICE3; chip layout; electric simulation; electrothermal simulator; infrared experimental set up; layout surface; power integrated circuits; software; thermal distribution; thermal simulation; Circuit simulation; Coupling circuits; Design automation; Electric variables; Electrothermal effects; Integrated circuit modeling; Packaging; Power integrated circuits; Predictive models; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Euro ASIC '92, Proceedings.
Conference_Location :
Paris
Print_ISBN :
0-8186-2845-6
Type :
conf
DOI :
10.1109/EUASIC.1992.228022
Filename :
228022
Link To Document :
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