SETIPIC: electrothermal simulator for power integrated circuits in EDGE environment

Author

Hebrard, Luc ; Klingelhofer, Christian ; Jacquemod, Gilles ; Boutherin, Bernard ; Le Helley, Michel

Author_Institution

LEAME, Ecole Centrale de Lyon, Ecully, France

fYear

1992

fDate

1-5 Jun 1992

Firstpage

214

Lastpage

219

Abstract

The authors present SETIPIC, a software to simulate the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface to the designer, SETIPIC has been integrated in the EDGE CAD system. The software aspect of this integration is explained. SETIPIC works around SPICE3 (electric simulation) and PICMOST (thermal simulation). This thermal simulator which calculates the thermal distribution on the layout surface of a chip taken in its environment is also described. Finally, an infrared experimental set up is proposed to validate SETIPIC and some thermal and electrothermal simulation results are given

Keywords

SPICE; circuit CAD; circuit layout CAD; digital simulation; integrated circuit technology; power integrated circuits; temperature distribution; thermal analysis; EDGE CAD system; EDGE environment; PICMOST; SETIPIC; SPICE3; chip layout; electric simulation; electrothermal simulator; infrared experimental set up; layout surface; power integrated circuits; software; thermal distribution; thermal simulation; Circuit simulation; Coupling circuits; Design automation; Electric variables; Electrothermal effects; Integrated circuit modeling; Packaging; Power integrated circuits; Predictive models; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Euro ASIC '92, Proceedings.

Conference_Location

Paris

Print_ISBN

0-8186-2845-6

Type

conf

DOI

10.1109/EUASIC.1992.228022

Filename

228022