DocumentCode :
3264043
Title :
System-on-silicon solution for high quality consumer video processing-the next generation
Author :
Schu, Markus ; Wendel, Dirk ; Tuschen, Christian ; Hahn, Marko ; Langenkamp, Ulrich
fYear :
2001
fDate :
2001
Firstpage :
94
Lastpage :
95
Abstract :
This paper presents the next generation of a highly integrated low cost single-chip video processing system-on-chip with outstanding feature content and performance. The IC3 unites the complete processing chain between tuner output (CVBS) and RGB processing. It comprises a perfected motion adaptive algorithm for high quality de-interlacing and up-conversion including a special cinematic source processing, picture-in-picture, split screen and manifold picture manipulation and improvement capabilities are implemented as well as color decoding and all necessary A/D and D/A conversions. All field memories are realized on-chip with YUV4:2:2 color representation up to SVGA resolution. Manufactured in a 0.18 μm copper eDRAM technology, the IC meets economical demands with increased functionality
Keywords :
DRAM chips; consumer electronics; decoding; digital signal processing chips; image colour analysis; image motion analysis; image representation; integrated circuit design; television receivers; video signal processing; 0.18 micron; A/D conversion; D/A conversion; IC3; SVGA resolution; YUV4:2:2 color representation; cinematic source processing; color decoding; eDRAM technology; functionality; high quality consumer video processing; high quality de-interlacing; improvement capabilities; manifold picture manipulation; motion adaptive algorithm; next generation; picture-in-picture; single-chip video processing system-on-chip; split screen; system-on-silicon solution; up-conversion; Color; Costs; Decoding; Image converters; Motion detection; Signal processing; Switches; TV; Three dimensional displays; Video compression;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Consumer Electronics, 2001. ICCE. International Conference on
Conference_Location :
Los Angeles, CA
Print_ISBN :
0-7803-6622-0
Type :
conf
DOI :
10.1109/ICCE.2001.935226
Filename :
935226
Link To Document :
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