DocumentCode :
3264237
Title :
Thermal assembly of polysilicon microactuators with narrow-gap electrostatic comb drive
Author :
Fedder, G.K. ; Chang, J.C. ; Howe, R.T.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkley, CA, USA
fYear :
1992
fDate :
22-25 June 1992
Firstpage :
63
Lastpage :
68
Abstract :
Surface micromachined, polysilicon fuse and weld microstructures are modeled, fabricated, and characterized. The current required to cut the thin, 2000 AA fuse is 30 mA, compared to 80 mA for a 2 mu m-thick fuse. For large currents, a simple model shows that the time to cut a fuse is inversely proportional to the square of the current. An aluminum microbridge is used to form a robust weld, connecting two polysilicon structures. The surface tension of the molten Al produces a force of approximately 15 mu M, which is about 100 times larger than electrostatic comb drive forces. A series of current pulses is used to melt the Al without destroying the weld joint.<>
Keywords :
electric actuators; electrostatic devices; elemental semiconductors; micromechanical devices; resistance welding; semiconductor technology; silicon; 30 mA; Al; fusible supports; microbridge; narrow-gap electrostatic comb drive; polycrystalline Si; polysilicon microactuators; resistive cutting; surface tension; thermal microassembly; weld joint; weldable structures; Aluminum; Assembly; Electrostatics; Fuses; Joining processes; Microactuators; Microstructure; Robustness; Surface tension; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
Print_ISBN :
0-7803-0456-X
Type :
conf
DOI :
10.1109/SOLSEN.1992.228275
Filename :
228275
Link To Document :
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