A simple experimental technique for the measurement of the work of adhesion of microstructures

Author

Mastrangelo, C.H. ; Hsu, C.H.

Author_Institution

Micro-Sensors & Actuators Dept., Ford Motor Co., Dearborn, MI, USA

fYear

1992

fDate

22-25 June 1992

Firstpage

208

Lastpage

212

Abstract

A method to measure the interfacial work of adhesion, gamma /sub s/, between undoped polysilicon beams and a silicon substrate is presented. The method relies on the peeling and detachment of polysilicon cantilever beams. Values of surface energy of gamma /sub s/=140+or-70 mJ m/sup -2/ were found for both hydrophilic and hydrophobic samples. The technique used should also be applicable to the measurement of gamma /sub s/ for other micromechanical material systems.<>

Keywords

adhesion; elemental semiconductors; interface phenomena; mechanical variables measurement; silicon; surface energy; surface energy measurement; surface structure; Michelson interferometer; Si; Si-Si; adhesion; detachment; hydrophilic samples; hydrophobic samples; interfacial work; micromechanical material; microstructures; peeling; polysilicon cantilever beams; surface energy; undoped polysilicon beams; Actuators; Adhesives; Laboratories; Micromechanical devices; Micromotors; Microstructure; Silicon; Structural beams; Surface tension; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest., IEEE

Conference_Location

Hilton Head Island, SC, USA

Print_ISBN

0-7803-0456-X

Type

conf

DOI

10.1109/SOLSEN.1992.228291

Filename

228291